Optica Online Industry Meeting: PIC Manufacturing, Packaging and Testing
27 August 2024 10:00 - 11:30
Eastern Daylight/Summer Time (US & Canada) (UTC -04:00)Join our online industry meeting focused on the dynamic world of Photonic Integrated Circuits (PICs) manufacturing, packaging, and testing. This event brings together industry leaders and innovators from across the PIC manufacturing ecosystem. We will delve into the significant transformations that packaging and testing of PICs have undergone to align with mass manufacturing demands, akin to the approaches seen in CMOS microelectronics. Emphasis will be on exploring strategies for achieving high throughput and yield, crucial in today's rapidly evolving technological landscape.
The summit will address the unique challenges in PIC assembly, such as the need for precision alignment, effective thermal management, and the complex co-packaging of photonic circuits with electronic drivers and host chips. The intricacies of PIC testing, which involves both electrical and optical probing with exacting standards for parameter requirements and positional accuracy, will also be a key focus. We aim to discuss the shift towards wafer-level-capable processes necessitated by increasing production volumes, fostering opportunities for collaboration and innovative solutions to make volume PIC manufacturing mainstream.
Speakers
Simone Cardarelli
MicroAlign, CEO
Simone Cardarelli is originally from Italy. He completed his bachelor's and master's studies in Electrical Engineering at the University of L'Aquila, Italy, by graduating cum laude in both academic courses. He has obtained his PhD degree in Photonic Integration at the Eindhoven University of Technology within the Electro-Optical Communication group. His PhD project was about optical fiber-to-chip connection for which he generated results presented at relevant international scientific conferences.
Simone is the full-time CEO and co-founder of MicroAlign BV since April 2021
